Chemical-Free Coating
February 1, 2010
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| The
Plasmadust process lends a new quality to the contacting of solar cells. |
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A new process allows for chemical-free metallization and coating
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| The patented Plasmadust technology allows users to metalize and
coat materials in a solvent-free, energy-efficient process. The coating process
is based on a combination of cold-active plasma and micro/nano particles. |
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Reinhausen Plasma GmbH has developed the world’s first
process for chemical-free and energy-saving metallization and coating for many
different materials. The nano-powder deposition technology, Plasmadust, enables
coating processes that are quality- and cost-optimized and environmentally
sound. The process can be used for applications including electronics,
photovoltaics, semiconductors and lightweight automobiles. In addition, it
creates opportunities for new applications.
The Plasmadust technology is based on a combination of cold-active plasma and
micro-powders. It allows for coating processes using metal, polymer,
semiconductor and other coatings to be carried out directly on two- and
three-dimensional substrates such as metal, plastic, silicon, glass, ceramic,
paper, board, and textiles in a chemical-free, thus VOC-free, process. It also
eliminates the need for the etching and acid-cleaning processes usually required
in surface processing.
Layer Deposition Using Cold-Active Plasma
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| The comparatively low temperature of approximately 120°C makes it possible to coat even
temperature-sensitive substrates such as plastics. The adjustable and uniform
particle flow ensures even and repeatable layer thicknesses. |
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Reinhausen Plasma uses its own plasma generator, Plasmabrush
PB2, for layer deposition with the Plasmadust process. Unlike conventional
atmospheric-pressure plasma systems, plasma gas is not generated in an
oscillating circuit, but rather on the basis of the inverter principle by means
of highly-effective, pulsed-arc discharges. This generates non-thermal plasma
with a measurable temperature of 120°C, which is made possible by the imbalance
of the energy content of light electrons and heavy gas particles under
atmospheric conditions. Compared to other common processes, such as
plasma/flame spraying, this results in considerably lower thermal stressing of
the basic substrate. In addition, the particle speeds of the Plasmadust process
are lower than those of other processes, such as cold gas and plasma spraying.
The continuous and agglomerate-free feeding of the coating powder, which has a
particle diameter of 100 nm to 20 µm, is carried out by a specially developed
atomizer/conveyor technology. An adjustable and uniform particle flow ensures
even and repeatable layer thicknesses.
The plasma’s physical properties, paired with ideally adjusted powder feeding,
make it possible to deposit cohesive layers on even extremely thin and/or
temperature-sensitive substrates (such as plastics, films and paper) with the
Plasmadust process. The repeatable layer thicknesses range from 1-100 µm and
processing speeds top out at 150 meters/min. Porosity can be set to 1-30%.
Depending on the type of powder, a coating path width of up to 10 mm can be
achieved with a plasma generator. A generator can be used in a scanning process
or several generators can be arranged together to coat or metalize larger
surfaces.
Potential for Coating Processes where Quality and Costs are Optimized
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| The setting of process parameters such as layer geometry,
path width and layer thickness can be adjusted to suit specific requirements
and parts. |
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Nearly any material that can be pulverized and melted is
suitable as a coating material: salt, gold, copper, aluminum, tin, bismuth,
tellurite, CIGS, polymers, thermoplastics, glass, and ceramic materials. For
example, salt as a fluxing agent can be deposited in a dry and controllable
process. In the case of printed circuit-board production, Plasmadust technology
allows circuit paths to be applied directly onto the board with use of a
template. Shorter production times and the use of less-expensive plastics can
increase the potential for cost savings. Other examples of applications for
Plasmadust technology include ecological and efficient wafer coating,
metallization and contacting of solar cells, the manufacture of flexible
circuit boards, and coatings for EMC shielding. Even semi-conductive materials
such as bismuth and tellurite can be deposited, such as for electrical
switching systems and the cost-efficient manufacture of generators in
thermoelectric applications. Deposition of a primer layer on rubber and
caoutchouc surfaces for metal/rubber composite systems is possible, as is the
creation of functional and decorative layers. In addition, alloys and material
composites such as carbon/metal, which cannot be treated with conventional
coating processes, can also be deposited.
Energy-Efficient Coating Provides High Cost Effectiveness
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| Plasmadust can process any material that can be pulverized
and melted, including salt, gold, copper, aluminum, tin, bismuth, tellurite,
CIGS, polymers (PTFE, PE, ABS, PP), glass, and ceramic materials. |
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The highly reactive micro or nano-powders melt at low
temperatures, thus the coating process requires considerably less power when
compared to conventional processes. For example, the coating/metallization of a
surface of one square meter uses from 1/10 to 1/100 of the energy required for
thermal spraying processes.
The Plasmadust system can be integrated into production lines as simply and
quickly as it can into roll-to-roll processing systems.
For more information, visit www.reinhausen-plasma.com.
About Reinhausen Plasma GmbH
Reinhausen
Plasma GmbH is a subsidiary of Maschinenfabrik Reinhausen GmbH, a worldwide
market leader and supplier of technology for the regulation of high-power
transformers. The company is based in Regensburg,
Germany.
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