TAPPI Announces Highlights for 2000 Hot Melt Symposium
The symposium will examine industry trends and the technologies on the horizon that will impact the future of hot melts. Topics will include: hot melt raw material trends in Europe; new isoprene TPEs for adhesives; smart tackifier selection; the additives approach for control of polymer degradation; heat exchanger equipment for hot melt products; alternate hot melt pressure sensitive technologies; and blended EVAs or reactor-grade EVAs for hot melt adhesives.
The symposium’s technical program is designed to meet the needs of technical, marketing and sales staff employed in the hot melt adhesive industry. Formulators, equipment manufacturers, suppliers and end users, both new and experienced, will benefit from attending. A Hot Melt Tutorial scheduled for Sunday, June 25 is designed to introduce attendees to a focused group of topics within the industry.
Janie Cameron, H.B. Fuller Co., will serve as chairperson of the symposium. To request more information or to register, call TAPPI’s service line at 800-332-8686 (United States), 800-446-9431 (Canada) or visit www.tappi.org/public/events.asp.