- THE MAGAZINE
- INFO FOR...
- ASI Store
- ASI Top 25
- ASI End User
- Classifieds and Services Marketplace
- Product & Literature Showcases
- List Rental
- Market Trends
- Custom Content & Marketing Services
- ASI Readers' Choice Awards
The Adhesion Society will host the second World Congress on Adhesion and Related Phenomena in conjunction with its 25th Annual Meeting, February 10-14, 2002, at the Hyatt Regency Hotel in Orlando, Fla.
Contributed papers will be accepted in all areas of adhesion and related phenomena. Papers will be presented as oral and as poster papers. The program chairs, in consultation with the principal authors, will determine the manner of presentation.
The principal topics for the symposia and contributed sessions include: New Adhesive Chemistry, “Green Adhesives,” Hot Melt Adhesives, PSAs, Microelectronics, Adhesives and Dentistry, Bio-Adhesion, Particle Adhesion, Durability, Recent Advances in Adhesion Science, Modeling and Simulation of Interfaces, Surface Energetics, Contact Mechanics, Non-Destructive Evaluation, Fracture Mechanics, Micromechanics of Adhesion, and Surface Chemistry.
Abstracts of 200-300 words for oral or poster presentations must be submitted by May 18, 2001. For information on how and where to send abstracts, contact the program co-chairs: Dr. Alphonsus Pocius, 3M, at 651-736-0287, e-mail firstname.lastname@example.org; or Professor John Dillard, Virginia Tech, 540-231-6926, e-mail email@example.com.