ASC's Fall Convention to Focus on New Technologies
The ASC invites individuals to take an active role in the upcoming convention by submitting abstracts for presentations. Topics include, but are not limited to: mechanical fasteners vs. adhesive bonding; adhesives in microelectronics; adhesives/sealants in transportation; packaging trends and technologies; recycling issues and environmentally benign adhesives; UV/radiation cure in adhesives and coatings; hot melts; pressure sensitive adhesives; testing and failure-mode analysis; new raw materials; mergers and acquisitions; and improving customer sales and relations.
The deadline for submission of an abstract is May 22, 2000. For information on sending an abstract, contact Michelle Stevens at firstname.lastname@example.org, or call 301-986-9700.