Dymax: Precision-Assembly Adhesive
April 27, 2000
Dymax OP-60 precision-assembly adhesive cures in seconds upon exposure to UV light, and minimizes movement of critical components during curing and subsequent thermal cycling. With a CTE of 58 ppm/ºC, OP-60 demonstrates very low expansion and shrinkage for a light-curable adhesive. In addition to its excellent low-shrink characteristic and exceptional cure speed, the product offers excellent moisture resistance, and very low outgassing, permitting its use in many critical and demanding applications.