TECHFILM: Literature On B-Staged Adhesive Films and Preforms
May 9, 2005
TechFilm Corp. has introduced its newest brochure on B-staged adhesive technology, company capabilities and technical data on available film and preform products. The literature was designed to provide assembly solutions for design and manufacturing engineers seeking alternatives to liquid adhesives and solders. The full-color, eight-page brochure includes detailed information on the company's full line of thermally conductive, electrically conductive, EMI/RFI shielding and structural B-staged adhesives. These partially cured, 100%-solid adhesives are an alternative to liquid adhesives and solders for highly intricate electronic and industrial bonding applications.