The 1053 Micro Melt precision valve utilizes proven rod displacement metering technology, providing extreme flow rate repeatability and accuracy from part to part. Depending on metering rod selection, the valve is capable of dispensing volumes from 0.002cc to 3.66cc of material. A servo-driven motor allows for bead extrusion to be as small as 1 mm in diameter for the smallest of bonding applications. Individual closed loop heat zones throughout the dispensing system optimize the hot melt/PUR temperature from the on-board feed cartridge to the metering rod and out to the point of dispense, while protecting the adhesive from being overheated and prematurely aged. Maximum processing temperature is 375 degrees F. The Micro Melt dispense technology is ideal for precision bonding of electronic devices and molded housings requiring only milligrams of adhesive in narrow bond lines. With the proper adhesive selection, the Micro Melt system can dispense accurately and efficiently enough to replace Ultrasonic welding, making for a much more controlled bond line and production process. Accurate adhesive placement and high throughput are guaranteed when the Micro Melt dispense valve is interfaced with one of Liquid Control's XYZ motion platforms.