TRA-CON OFFERS ONE-COMPONENT ADHESIVE FOR MICROELECTRONICS APPLICATIONS
March 8, 2004
TRA-BOND 789-3 is a high-strength, one-component adhesive designed for applications in the microelectronics industry that require good moisture resistance, like package sealing and substrate attach. It retains its bond strength under such conditions, has a high ultimate glass transition temperature (Tg) of 126 degrees C, and exhibits great adhesion to difficult-to-bond-to metals, such as gold, silver, and copper. TRA-BOND 789-3 can be cured for one hour at 125 degrees C or as quickly as a half hour at 150 degrees C. TRA-BOND 789-3 is a NASA outgassing approved adhesive and is available in various colors to suit many application needs.
For more information, visit http://www.tra-con.com or call (800) TRA-CON1.