Speedline Technologies: MPM Next Generation Pump
November 17, 2003
Speedline Technologies Inc. has introduced MPM's next generation pump technology, a design that reduces materials costs, facilitates quick changeovers and expands the range of usable materials. The pump represents a completely unique approach to paste management, featuring a smaller paste chamber that reduces material waste and compaction, and disposable inserts for simplified cleaning and reduced maintenance downtime. Improvements in product yield are achieved through proximity membrane sensing and direct pressure control, enabling accurate material deposition, especially for challenging paste-in-hole applications.
For additional information, call 508-520-0083.