ASC Presents Adhesives Forum at Assembly Technology Expo
August 12, 2003
The Adhesive and Sealant Council has announced that it will sponsor a new "Adhesive Forum" on Wednesday, Sept. 24, from 10:00 am to 1:00 pm., at Assembly Technology Expo 2003. This half-day session, which will be held in conjunction with the ATExpo exhibition at the Donald E. Stephens Convention Center in Rosemont, IL, is designed to educate end-users about innovations in the adhesives used in various assembly applications. The forum will feature five ASC members discussing different uses of adhesives in assembly applications.
For more information, call 301-986-9700.