Henkel Announces Opening Of New Research And Applications Center
February 1, 2005
The electronics group of Henkel has announced the grand opening of its Irvine, CA, Research and Applications Center. The 53,000 sq. ft. state-of-the-art facility will house R&D and applications engineering for the company's die attach, semiconductor underfill, encapsulant, and semiconductor mold compound products. Application engineering activities for the company's electronics assembly materials, including solder paste, surface mount adhesives, conformal coating, potting and board level underfills will also take place in the new Irvine location. The facility is the new global headquarters for the electronics group of Henkel and marks the first official opening of several planned worldwide facilities for the electronic materials leader. The grand opeing ceremony for the new Research and Applications Center is scheduled for Feb. 21, 2005.