TECHFILM: B-Staged Adhesive Film
July 18, 2005
TechFilm Corp. has introduced 12202F, a high-performance, structural B-staged film adhesive capable of developing a 4500 psi bond strength on difficult-to-bond metal substrates such as gold, invar, nickel and engineering and LCP plastics. Partially cured, 100% solid B-staged adhesives are an alternative to liquid adhesives and solders for highly intricate industrial and electronic bonding applications. Available in sheet, preform or roll formats as thin as 1 mil, this film is ideal for applications where size and thinness of the final part is critical. Actual applications include piezoelectric devices, ultrasonic sensors and print heads.