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HENKEL: Structural Film Adhesive (10/14/09)

October 14, 2009
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The aerospace group of Henkel has announced the release of Hysol® PL696 epoxy-based structural film adhesive. The new adhesive is designed primarily for out-of-autoclave curing process applications, and is also available in lightning strike configuration. It is a low-temperature-cure film product that eliminates the need for autoclave curing and can be cured with a vacuum bag at just 140°F. In addition, it improves the surface quality of composite structures and is able to bond a variety of similar and dissimilar materials.

Hysol PL696 meets the requirements of military pacification MMM-A-132. Henkel’s aerospace group will be launching this product and other products for structural adhesives and metal surface treatments at SAMPE Wichita, Oct. 20-21, 2009, in booth #910.

For more information, visit www.henkelna.com/aerospace.

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