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NuSil Technology LLC has introduced EPM-2890, a thermally conductive, non-corrosive silicone adhesive. The adhesive can provide moderate heat transfer between electrical components and their heat sinks. In addition, EPM-2890 exhibits less than or equal to 1% weight loss when heated for 30 minutes at 275ºC to withstand lead-free solder reflow.
EPM-2890 is a one-part white silicone adhesive that will room-temperature vulcanize, with moisture, in 72 hours. It can be used as an adhesive or sealing, caulking or potting material in electronics applications that require minimal volatility to avoid condensation in sensitive devices. For applications in which adhesion is important (e.g., bonding for ruggedizing LCD displays), EPM-2890 offers 100 psi minimum primer-less adhesion on aluminum. It provides enhanced thermal conductivity at 0.6 W/(mK) for applications in which stress relief during thermal cycling and heat management are desired.
For more information, visit www.nusil.com.