Formulators / Manufacturers / Finished Adhesives and Sealants

Advancing Adhesives: Multi-Metal Compatibility

New electrically conductive adhesive from Henkel provides compatibility with multiple metals.
 
Henkel Electronic Materials has developed an electrically conductive adhesive (ECA) that overcomes the drawbacks of older generation ECAs and extends the material’s advantages to multiple applications. The adhesive system, HYSOL ECCOBOND CE 3103WLV, reportedly provides exceptional contact resistance stability on surfaces such as OSP copper and Sn alloys—metals that had previously been challenging for ECAs.
 
ECAs have been used for high-reliability applications such as automotive, medical and telecom products for some time, as they offer lower temperature processing, fine-pitch capability, and improved thermal cycling resistance. With these applications, ECAs have most often been used on devices with noble metallizations such as gold, silver, palladium and even ceramic substrates, but have had limited success on common electronic metals such as copper and Sn alloys. Technical research conducted by Henkel, however, has revealed that electrochemical corrosion of these metals under elevated temperature and humidity is the root cause of the unstable contact resistance. Using this understanding as a foundation, Henkel developed HYSOL ECCOBOND CE 3103WLV to overcome these issues and deliver multi-metal compatibility.
 
The material has been incorporated into a variety of applications and, most recently, optical technology powerhouse LensVector has selected HYSOL ECCOBOND CE 3103WLV for use with its AutoFocus (LVAF) product. The LVAF is the world’s smallest autofocus device, which uses a unique patented technology to transform a single liquid crystal cell into a variable focus lens that can then be integrated by camera module manufacturers to deliver autofocus capability.
 
Bahram Afshari, LensVector vice president of Engineering, explains the demanding requirements of its product and why the company partnered with Henkel. “Not only do the contacts between the LVAF and the main module serve to make the electrical connections, but they must also meet the challenging reliability requirements for camera phones, notebook computers and other handheld consumer electronic devices that incorporate these modules,” he said. “HYSOL ECCOBOND CE 3103WLV delivers the electrical conductivity and reliability performance in an easily dispensed, high-yield, low-temperature cure ECA. In fact, the cure temperature is well below most traditional ECAs, which gives us added process and module material selection flexibility.”
 
The low-temperature processing capability is a result of the formulation of HYSOL ECCOBOND CE 3103WLV, which uses new corrosion inhibitors and effectively extends its viability to applications requiring low-temperature processing.
 
“This material is a highly effective alternative to solder for applications that must be processed at low temperature,” said Tom Adcock, global product manager of Assembly Adhesives for Henkel. “Its ability to provide outstanding conductivity and reliability with multiple metallizations makes it incredibly adaptable and its application effectiveness far-reaching.”
 
The adaptability of the material was also a central component of LensVector’s selection. “Identifying the right ECA is a critical step in LensVector’s efforts to integrate this new autofocus technology into existing, fixed-focus camera modules,” Afshari said. “HYSOL ECCOBOND CE 3103WLV enables the addition of autofocus capability without changing the module footprint.”
 
For more information, call (888) 943-6535 or visit www.henkel.com/electronics. LensVector’s website is located at www.lensvector.com.

Did you enjoy this article? Click here to subscribe to Adhesives & Sealants Industry Magazine.

You must login or register in order to post a comment.

Multimedia

Videos

Image Galleries

ASI April 2014 Photo Gallery

Our April 2014 issue is now available!

Podcasts

ExxonMobil Tackifier Expansion

Dwight Tozer, vice president of ExxonMobil’s Adhesion Industry business, discusses the company’s latest tackifier expansion project with Editor-in-Chief Susan Sutton.

More Podcasts

Adhesives & Sealants Industry Magazine

ASI December 2014 cover

2014 December

The annual Buyers' Guide is here! You won't want to miss this.

Table Of Contents Subscribe

Bonding Plastics

Are you involved in bonding plastics or other difficult-to-bond substrates?
View Results Poll Archive

THE ADHESIVES STORE

handbook-sealant-tech.gif
Handbook of Sealant Technology

The Handbook of Sealant Technology provides an in-depth examination of sealants, reviewing their historical developments and fundamentals, adhesion theories and properties, and today’s wide range of applications.

More Products

ASI 2014 Buyers GuideASI's Buyers' Guide

Annual purchasing resource for equipment used in the manufacture/formulation of adhesives, sealants, pressure sensitives, tapes and labels and for application of finished adhesives. 

STAY CONNECTED

facebook_40px twitter_40  youtube_40pxlinkedin_40 google+ icon ASI 30px

Clear Seas Research

With access to over one million professionals and more than 60 industry-specific publications, Clear Seas Research offers relevant insights from those who know your industry best. Let us customize a market research solution that exceeds your marketing goals.