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This company’s new underfill system is designed to reduce package stress through controlling die and substrate warpage. LOCTITE ECCOBOND UF 8840 is a high-performance underfill specifically designed to meet the demands of modern semiconductor flip chip devices.
The material reportedly offers compatibility with a variety of flux systems, has minimum resin bleed-out, delivers maximum process adaptability through compatibility with both traditional needle dispensing and non-contact dispensing, and has a wide dispense process window for manufacturing flexibility. It has been formulated to flow consistently with no voids on flip chip die up to 15 x 15 mm.
For additional information, visit www.henkel.com/electronics.