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H.B. Fuller Co. recently announced it has finalized the purchase of Engent, Inc., a provider of manufacturing, research and development services to the electronics industry. The Engent business reportedly adds state-of-the-art development capabilities, testing resources and technical support infrastructure.
As a global adhesives solutions provider in the electronics market, H.B. Fuller reportedly has now increased its market knowledge and qualification capabilities in a range of microelectronic assembly technologies. The company will combine and leverage the adhesive development capabilities, investment resources and global reach of H.B. Fuller with the electronics expertise of Engent.
“With this acquisition, we add advanced application technology, people and process knowledge that will enhance our growing business in electronics,” said Jim Owens, president and CEO of H.B. Fuller. “Within this market, there is a diverse range of technologies being produced today and under development for production tomorrow. We plan to participate fully in these opportunities in this dynamic segment by combining and leveraging the adhesive development capabilities, investment resources and global reach of H.B. Fuller with the electronics expertise of Engent.”