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ASC and ASI Stage Adhesives Symposium

March 27, 2001
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Adhesives & Sealants Industry Magazine and the Adhesive and Sealant Council are sponsoring the Adhesives for Product Assembly Symposium, June 18-19, 2001, at the Michigan State University Management Education Center in Troy, Mich.

TROY, Mich. — Adhesives & Sealants Industry Magazine, Troy, Mich., and the Adhesive and Sealant Council, Inc., Bethesda, Md., are sponsoring the Adhesives for Product Assembly Symposium, June 18-19, 2001, at the Michigan State University Management Education Center in Troy, Mich. Adhesives for Product Assembly is a highly focused symposium aimed at showcasing adhesives used in various applications including automotive, furniture construction, appliances and electronics. Robert W. Smith, of The ChemQuest Group, is the program moderator. The speakers represent adhesives end users, manufacturers of adhesives, equipment suppliers, R&D/academia, and consultants.

Among the topics to be addressed are: Why use Adhesive Assembly?; Structural vs. Assembly Joining; Key Design Factors for Successful Adhesive Assembly; Environmental Concerns — Understanding the MSDS; The Adhesive-Joining Process; Rules for Good Adhesive Assembly; Any Surface Preparation?; Automated Dispensing; How to Design for Six Sigma Quality Using Adhesive Assembly; Integrating Design for Manufacturability; and Design for the Environment.

On Monday, June 18, following the afternoon session, there will be a reception with tabletop exhibits.

For further information on the symposium, or to register, contact Monica Paul, Adhesives & Sealants Industry Magazine, 248-244-8264; or Liz Langlie, The Adhesive and Sealant Council, Inc, 301-986-9700, ext. 107.

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