Chicago hosts ATExpo

September 1, 2004
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Assembly Technology Expo (ATExpo) is scheduled to take place Sept. 27-30 at the Donald E. Stephens Convention Center in Rosemont (Chicago), IL.

The world's largest "all assembly" trade event, ATExpo will showcase the newest technology, ideas and solutions manufacturers need to optimize assembly operations. Over 600 suppliers will showcase hundreds of new assembly products, technologies and processes in hands-on displays. Technology pavilions dedicated to electronics assembly, robotics and wire processing will allow visitors to view working assembly lines.

In addition, ASI is organizing the session "Advances in Tabletop Automation to Meet Manufacturing Challenges." The session, to take place at 2-4 p.m. on Sept. 29, will be moderated by ASI publisher Sue Love and will focus on advances in tabletop dispensing technology from improved productivity to new adhesive products. Scheduled speakers include: Michelle Carberry, Application Engineer, Henkel Loctite Corp.; Jere Donahue, Integrated Dispensing Solutions, Inc.; Fabio Okada, Automation Product Manager, Liquid Control Corp.; Terry Dunbar at EFD; and Jay Richardson, North American Sales Manager, Eastern Division, OK International.

Other sessions in the Adhesives track include: "Fundamentals of Adhesive Technology" (Sept. 28, 10 a.m. - 1 p.m.); "Adhesive Processing and Selection" (Sept. 28, 2-5 p.m.); "Adhesives in Assembly: Delivering Superior Form + Function" sponsored by ASC (Sept. 29, 10 a.m. - 1 p.m.); and "Adhesives, Potting and Encapsulating" (Sept. 30, 10 a.m. - 12:25 p.m.).

For more information on ATExpo, visit http://www.atexpo.com .

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