Microcircuit Silver conductive adhesives are one-part, thermoset silver epoxies designed for conductive bonding of microcircuit assemblies such as IC chips and capacitors. Types K and L are ideal for thermal compression bonding, and Types N and O are 100%-solids systems with outstanding outgassing characteristics. All products offer room-temperature storage and can be applied by screen printing or automatic dispensing. Circle No. 215
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Edward Gotch, president of Emerald Kalama Chemical, talks about embracing sustainability with Susan Sutton, editor-in-chief.
The 2013 May Adhesives and Sealants Industry Magazine includes articles about PPG and Bostik, as well as a Q&A about polyurethane. Check it out today!
The Handbook of Sealant Technology provides an in-depth examination of sealants, reviewing their historical developments and fundamentals, adhesion theories and properties, and today’s wide range of applications.
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