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Cotronics: Adhesive For Dissimilar Materials

Resbond™ S5H13 adhesive is specially formulated to bond dissimilar materials for use in high-temperature, corrosive environments. It has excellent adhesion to metals, plastics, high-performance composites, glass and ceramics. The epoxy cures at room temperature and is usable to 500°F. It features excellent high-temperature resistance to corrosion, all common chemicals, thermal shock and electricity.

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2013 May

The 2013 May Adhesives and Sealants Industry Magazine includes articles about PPG and Bostik, as well as a Q&A about polyurethane. Check it out today!

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Handbook of Sealant Technology

The Handbook of Sealant Technology provides an in-depth examination of sealants, reviewing their historical developments and fundamentals, adhesion theories and properties, and today’s wide range of applications.

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Annual purchasing resource for equipment used in the manufacture/formulation of adhesives, sealants, pressure sensitives, tapes and labels and for application of finished adhesives. 

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