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Editor’s Memo
Industry Events Score High Marks

August 28, 2003
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The TAPPI three-day conference featured several concurrent sessions in the technical program, covering topics including hot melts (both formulation and application), new developments in film, equipment, pretreatment, and resins, among others.

This August, I had the opportunity to attend the 2003 TAPPI PLACE Conference and Global Hot Melt Symposium at the Rosen Center Hotel in Orlando, FL. While Orlando might not be at the top of your destination list for August, if you are involved with the packaging, converting and hot melt industries, then TAPPI certainly should be. The three-day conference featured several concurrent sessions in the technical program, covering topics including hot melts (both formulation and application), new developments in film, equipment, pretreatment, and resins, among others. The sessions were well attended, and lively discussions took place during the question-and-answer sessions and each of the breaks.

The Hot Melts New Technology Showcase featured presentations from several companies on new and innovative technologies that they have created. These included a hybrid hot-melt adhesive from Liquid Polymer Co.; oligomers from Sartomer for formulating UV/EB adhesives; polyols, polyurethane dispersions and non-migratory surfactants from Uniqema; and polyols, antioxidants and antimicrobials for hot melts from Ciba.

Monday night’s Table Top Reception featured about 30 exhibitor booths, each growing more crowded as the evening progressed. The reception offered another wonderful opportunity for networking among exhibitors, presenters and attendees.

The 2004 TAPPI PLACE Conference and Global Hot Melts Symposium is scheduled to take place Aug. 29-Sept. 4 at the Westin International Hotel in Indianapolis.

I am also looking forward to attending this fall’s ASC Convention and Exposition, scheduled for Sept. 21-24 at the Hyatt Regency O’Hare Hotel in Rosemont (Chicago), IL. Exhibiting companies include suppliers and distributors of services, software, raw materials, and equipment (production, manufacturing, and testing). This convention will be co-located with Assembly Tech Expo, which will run Sept. 23-25. New this year at the ASC Convention is the Supplier Spotlight, an opportunity for ASC member companies to showcase new products or services by giving mini-presentations on the Expo floor.

The ASC will be sponsoring a new session at the AT Expo on Wednesday, Sept. 24. The “Adhesives Forum” is designed to educate end-users about innovations in adhesives used in various assembly applications and will feature five ASC members discussing different uses of adhesives in assembly applications. In addition, the ASC will have a booth at the AT Expo showcasing the new Building the Industry (BTI) Program.

For more information:

For more information about the ASC Convention, visit www.ascouncil.org.

For more information on AT Expo, visit www.assemblytechnologyexpo.com.

For more information on the 2004 TAPPI PLACE Conference and Global Hot Melt Symposium, visit www.tappi.org.

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