This company’s CE 3100 electrically conductive adhesive is a lead-free alternative to solder for surface-mount device (SMD) interconnect formation. This one-component, thermosetting product contributes to reliable SMD assemblies, is compatible with existing SMD assembly lines and provides outstanding fine-pitch printing capability. The product uses new, proprietary oxide-reducing technology to provide breakthrough electrical-junction stability and reliability on all common metal solderable surface finishes.