Master Bond EP21AC is a two-part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
DELO has developed DELO PHOTOBOND UV acrylates for optoelectronics that reportedly enable fast and true-color bonding of holographic films manufactured by Covestro.
Our February issue brings articles on a wide range of topics, including green formulations and applications, curing materials, transportation end uses, and much more.
To start us off, Jowat’s Gerhard Haas asks: How can we make adhesives and bonding processes more sustainable? Luckily, he also provides some insightful answers clustered under a central recommendation to seek a holistic approach to sustainability. Learn more in “Green Bonding.”
The use of adhesives in electric vehicles (EVs) is even more widespread than in conventional automobiles. In both types of vehicles, adhesives offer many advantages, including ease of use compared to welding, environmental resistance, sealing, distributing stress, and joining dissimilar materials.
Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required.
The event featured a technical conference, professional development courses, standards development committee meetings, and a show floor that included 282 exhibitors.
February 10, 2022
Organizers of IPC APEX EXPO 2022 report that the event provided the education and networking connections that helped 3,647 visitors address today’s business challenges and prepare for their factories of the future.
Henkel has introduced three new low-pressure molding (LPM) materials designed to seal and protect medical devices from moisture, temperature extremes, chemicals, vibration, impact, and other environmental concerns.
ViscoTec recently introduced cartridge applicators featuring Festo pneumatic control modules for the exact and clean feeding of adhesives, pastes, and silicones of different viscosities.
A new agreement for ActiveCopper™ products will enhance DuPont Microcircuit and Components Materials’ thick film paste portfolio.
January 27, 2022
The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry.