ViscoTec recently introduced cartridge applicators featuring Festo pneumatic control modules for the exact and clean feeding of adhesives, pastes, and silicones of different viscosities.
A new agreement for ActiveCopper™ products will enhance DuPont Microcircuit and Components Materials’ thick film paste portfolio.
January 27, 2022
The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry.
The new versatile and single-component hot-melt polyurethane reactive range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices.
January 13, 2022
Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.
IPC APEX EXPO returns as an in-person event January 22-27 in San Diego, Calif.
January 12, 2022
IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.
Nine in 10 electronics manufacturers reported rising materials costs, and more than three-fourths reporting rising labor costs.
January 5, 2022
IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.
Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.
December 9, 2021
A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.
The Industrial Advisory Committee will consist of expert leaders representing a range of organization sizes from industry, federal laboratories, and academic institutions.
December 6, 2021
The U.S. Commerce Department has established a high-level committee to advise the U.S. government on matters related to microelectronics research, development, manufacturing, and policy and is now seeking to recruit top-level candidates to serve on the committee.
The facility will produce a range of materials to advance applications for electrification and lightweighting in support of growing demand for DuPont’s automotive adhesives.
November 22, 2021
DuPont has broken ground on a previously announced $30 million facility in Zhangjiagang, China.