Neximid PETA enables heat-activated ethynyl crosslinking of polyimides at lower temperatures than previously possible. The material is a purely heat-activated crosslinker that can be catalyzed, thus enabling the crosslinking temperature to be lowered and set at the desired level. Polyimide films crosslinked with the material are given increased heat resistance, dimensional stability, and a lowered CTE value. Application areas include electronics, electrical and aerospace.

“We are very satisfied to be the first in the world to introduce this product, which addresses an urgent request expressed by customers in the polyimide segment,” said Jan-Erik Rosenberg, technical director. “This request can be summarized as being able to crosslink polyimides at much lower curing temperatures, but retaining the same crosslinking mechanisms and stable end structures as is achieved with PEPA.”

For more information, visit www.nexam.se.