Adhesives Magazine

3M AEROSPACE: Structural Void Filling Compounds

June 1, 2011

3M™ Scotch-Weld™ structural void filling compounds EC-3550 B/A FST and EC-3555 B/A FST are low-density void fillers. The compounds can reportedly help save time and costs in aircraft production by eliminating process steps, reducing worker time, and speeding throughput. With a combination of easy dispensability and non-sag performance, the compounds offer a number of productivity-enhancing advantages.

The lightweight, extrudable, and pumpable compounds can offer superior handling attributes and dispensability. The simplified preparation and cleanup for the compounds eliminates weighing, mixing and potential re-packaging, thus saving production time. With fast, direct application, the products can reduce-and in some instances, eliminate-hand troweling and trapped air, helping to avoid pinholes, voids, and porosity.

For more information, visit www.3M.com/ldvf.