Adhesives Magazine

Henkel: Underfill

March 19, 2012

 

henkelThis company has developed LOCTITE UF3810, a new underfill technology that reportedly provides extremely high reliability while also allowing for easier reworkability compared to previous generation products. Designed to deliver superior performance and ease-of-use, the underfill can address many of the complex requirements associated with today’s high value devices, but does so in a formulation that has excellent processability. The halogen-free material is reportedly reworkable and has a glass-transition (Tg) temperature of 100°C, thereby delivering robust thermal cycling reliability for next-generation wafer-level CSP (WLCSP) and PoP devices.

The material can be used in handheld communication and entertainment applications. It flows fast and underfills at room temperature, and can cure quickly at 130°C.

For more information, visit www.henkel.com.