Adhesives Magazine

Adhesion Society Call for Papers

March 27, 2001
BLACKSBURG, Va. — The joining of the Adhesion Society’s 25th Annual Meeting with the second World Congress on Adhesion and Related Phenomena (WCARP-II) is the result of a decision reached in 1994 by the Adhesion Society Inc., The Adhesion Society of Japan and EURADH (a consortium of British, French and German adhesion groups) to organize a global event in the field of adhesion science on a four-year-rotation basis. It was decided to merge the World Congresses with the regular meetings of the co-organizing societies to diminish the proliferation of conferences on adhesion.

The Adhesion Society will host the second World Congress on Adhesion and Related Phenomena in conjunction with its 25th Annual Meeting, February 10-14, 2002, at the Hyatt Regency Hotel in Orlando, Fla.

Contributed papers will be accepted in all areas of adhesion and related phenomena. Papers will be presented as oral and as poster papers. The program chairs, in consultation with the principal authors, will determine the manner of presentation.

The principal topics for the symposia and contributed sessions include: New Adhesive Chemistry, “Green Adhesives,” Hot Melt Adhesives, PSAs, Microelectronics, Adhesives and Dentistry, Bio-Adhesion, Particle Adhesion, Durability, Recent Advances in Adhesion Science, Modeling and Simulation of Interfaces, Surface Energetics, Contact Mechanics, Non-Destructive Evaluation, Fracture Mechanics, Micromechanics of Adhesion, and Surface Chemistry.

Abstracts of 200-300 words for oral or poster presentations must be submitted by May 18, 2001. For information on how and where to send abstracts, contact the program co-chairs: Dr. Alphonsus Pocius, 3M, at 651-736-0287, e-mail avpocius1-@mmm.com; or Professor John Dillard, Virginia Tech, 540-231-6926, e-mail john.dillard@vt.edu.