ADVANCING ADHESIVES: Electrically Conductive Adhesive Offers Quick Cure
July 1, 2010
Material can replace solder paste and slow-curing adhesives.
Delivering a new alternative to high-temperature solder processes, Henkel has
developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive
adhesive designed to offer fast cure at low temperature. The material is ideal
for high-throughput production processes and applications that dictate high
peel strength, such as the assembly of photovoltaic (PV) modules, automotive
sensors and membrane switches that incorporate temperature-sensitive
substrates.
While solder is arguably the most common electrical interconnect material, its high temperature requirements make it impractical for certain applications. Fragile, thin, temperature-sensitive substrates are often subject to damage not only from the requisite soldering temperatures, but also from screen and stencil printing processes themselves. Hysol ECCOBOND CA3556HF resolves these issues with fast, low-temperature curing.
“This material is not just a superior replacement for solder in certain applications,” said Vito Buffa, Henkel global product manager for Pastes and Inks. “Hysol ECCOBOND CA3556HF also has advantages over other electrically conductive adhesives that burden users with long cure times and limited flexibility. This material’s cure speed and versatility are unmatched.”
While it was initially designed to address the requirements of the PV module assembly market, the material has found other uses. Its flexibility can benefit other facets of the PV sector, as it is suitable for both crystalline-silicon (c-Si) and thin film manufacturing. For c-Si cell production, Hysol ECCOBOND CA3556HF delivers an excellent bond between the Ag- and SnPbAg-coated tabs and the c-Si cells. Thin film module manufacturers seeking a low-stress, fast-cure electrical interconnection of cells with ribbons have also incorporated the material into their processes with great success.
“Not only are PV specialists benefiting from the materials’ performance,” Buffa said, “but any manufacturer requiring a fast, low-temperature cure for high-throughput operations can realize the competitive advantage this product delivers. Some of these applications include membrane switches, displays on temperature-sensitive substrates, automotive sensor and RFID tag assembly.”
Other benefits of Hysol ECCOBOND CA3556HF include high peel and shear strength; stress minimization properties to compensate for CTE mismatches; fast cure for high throughput; and a no-mix, one-part formula that reduces operator error and speeds processing time.
For more information, call (888) 9HENKEL or visit www.henkel.com/electronics.
Figure 1.
While solder is arguably the most common electrical interconnect material, its high temperature requirements make it impractical for certain applications. Fragile, thin, temperature-sensitive substrates are often subject to damage not only from the requisite soldering temperatures, but also from screen and stencil printing processes themselves. Hysol ECCOBOND CA3556HF resolves these issues with fast, low-temperature curing.
“This material is not just a superior replacement for solder in certain applications,” said Vito Buffa, Henkel global product manager for Pastes and Inks. “Hysol ECCOBOND CA3556HF also has advantages over other electrically conductive adhesives that burden users with long cure times and limited flexibility. This material’s cure speed and versatility are unmatched.”
While it was initially designed to address the requirements of the PV module assembly market, the material has found other uses. Its flexibility can benefit other facets of the PV sector, as it is suitable for both crystalline-silicon (c-Si) and thin film manufacturing. For c-Si cell production, Hysol ECCOBOND CA3556HF delivers an excellent bond between the Ag- and SnPbAg-coated tabs and the c-Si cells. Thin film module manufacturers seeking a low-stress, fast-cure electrical interconnection of cells with ribbons have also incorporated the material into their processes with great success.
“Not only are PV specialists benefiting from the materials’ performance,” Buffa said, “but any manufacturer requiring a fast, low-temperature cure for high-throughput operations can realize the competitive advantage this product delivers. Some of these applications include membrane switches, displays on temperature-sensitive substrates, automotive sensor and RFID tag assembly.”
Other benefits of Hysol ECCOBOND CA3556HF include high peel and shear strength; stress minimization properties to compensate for CTE mismatches; fast cure for high throughput; and a no-mix, one-part formula that reduces operator error and speeds processing time.
About the Company
Henkel has been committed to making people’s lives easier, better and more beautiful for more than 130 years. A Fortune Global 500 and Germany’s most admired company according to a recent Fortune survey, Henkel offers strong brands and technologies in three areas of competence: home care, personal care and adhesive technologies. In fiscal 2009, Henkel generated sales of €13,573 million and adjusted operating profit of €1,364 million.For more information, call (888) 9HENKEL or visit www.henkel.com/electronics.