Material can replace solder paste and slow-curing adhesives.
Delivering a new alternative to high-temperature solder processes, Henkel has
developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive
adhesive designed to offer fast cure at low temperature. The material is ideal
for high-throughput production processes and applications that dictate high
peel strength, such as the assembly of photovoltaic (PV) modules, automotive
sensors and membrane switches that incorporate temperature-sensitive
While solder is arguably the most common electrical interconnect material, its
high temperature requirements make it impractical for certain applications.
Fragile, thin, temperature-sensitive substrates are often subject to damage not
only from the requisite soldering temperatures, but also from screen and
stencil printing processes themselves. Hysol ECCOBOND CA3556HF resolves these
issues with fast, low-temperature curing.
“This material is not just a superior replacement for solder
in certain applications,” said Vito Buffa, Henkel global product manager for
Pastes and Inks. “Hysol ECCOBOND CA3556HF also has advantages over other
electrically conductive adhesives that burden users with long cure times and
limited flexibility. This material’s cure speed and versatility are unmatched.”
While it was initially designed to address the requirements of the PV module
assembly market, the material has found other uses. Its flexibility can benefit
other facets of the PV sector, as it is suitable for both crystalline-silicon
(c-Si) and thin film manufacturing. For c-Si cell production, Hysol ECCOBOND
CA3556HF delivers an excellent bond between the Ag- and SnPbAg-coated tabs and
the c-Si cells. Thin film module manufacturers seeking a low-stress, fast-cure
electrical interconnection of cells with ribbons have also incorporated the
material into their processes with great success.
“Not only are PV specialists benefiting from the materials’ performance,” Buffa
said, “but any manufacturer requiring a fast, low-temperature cure for
high-throughput operations can realize the competitive advantage this product
delivers. Some of these applications include membrane switches, displays on
temperature-sensitive substrates, automotive sensor and RFID tag assembly.”
Other benefits of Hysol ECCOBOND CA3556HF include high peel and shear strength;
stress minimization properties to compensate for CTE mismatches; fast cure for
high throughput; and a no-mix, one-part formula that reduces operator error and
speeds processing time.
About the Company
Henkel has been committed to making people’s lives easier,
better and more beautiful for more than 130 years. A Fortune Global 500 and Germany’s most
admired company according to a recent Fortune survey, Henkel offers strong
brands and technologies in three areas of competence: home care, personal care
and adhesive technologies. In fiscal 2009, Henkel generated sales of €13,573
million and adjusted operating profit of €1,364 million.
For more information, call (888) 9HENKEL or visit www.henkel.com/electronics.