Adhesives Magazine

Asia FlexPak Conference Scheduled For June

March 7, 2005
The 4th Asia FlexPak Conference, organized by Centre for Management Technology (CMT), has been scheduled for June 20-21 in Guangzhou, China. The two-day conference will focus on key business and technical issues facing the flexible packaging industry, latest developments in materials, technologies and applications, as well as emerging market trends and implications for the future direction of the industry in Asia. While the general outlook for the flexible packaging market is optimistic (with an average annual growth rate of 3.5%), the industry envisions greater pressure on margins due to rising costs and limited supply of raw materials. Coupled with over-investment in new capacity and, thus, oversupply of materials (especially in China), weak pricings and low returns are further worsened.

For more information, visit http://www.cmtevents.com or e-mail mail cynthia@cmtsp.com.sq.