June 2007
Question: Can you give me some tips on formulating a high-temperature
epoxy adhesive?
Answer: There are several things you can do to improve the
heat resistance of such an adhesive. When cured at room temperature, simple
two-part epoxies usually have a glass-transition temperature (T
g)
only 20 or 30 degrees above room temperature, thus limiting their ability to
bear loads at moderately elevated temperatures. More complete curing and higher
T
gs can often be achieved by heat-curing at 100-130°C.
Other ways of increasing heat resistance are to blend epoxy novolac resins with
conventional bisphenol A-based resins and to use special types of hardeners.
For example, anhydride hardeners can produce very high T
g
resins, but require curing at high temperatures for extended periods.
Question: We are thinking of
getting into manufacturing polyurethane sealants for some construction
applications, but have heard that there are some modified urethanes that don’t
involve the handling of isocyanates. Do you have any knowledge of these?
Answer: You’re thinking of two types of sealants. The
first are based on polyether polyol backbones that are end-capped with alkoxy
silane groups; the second are true polyurethane polymers, again with the alkoxy
silane end groups. These polymers can react with moisture, liberate small
amounts of alcohol and crosslink just like one-component RTV silicones. These
sealants are sometimes called “modified silicones,” “modified urethanes” or
“hybrid” sealants. Because they don’t contain isocyanates, they do not have
some of the negatives associated with these, such as gas bubble formation or
the irritancy of isocyanates. These sealants are said to be particularly useful
in applications where their non-staining characteristics and excellent adhesion
provide long-term use without significant changes in properties. They are also
noted for low viscosities at low temperatures, which aids in application.
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