Papers are invited for a Symposium on Advances in Adhesives, Adhesion Science and Testing, sponsored by ASTM Committee D14 on Adhesives. The symposium will be held Monday, Oct. 4, 2004, in Washington D.C. The symposium will focus on new adhesives particularly from the perspective of newer test methods emerging to better determine adhesive reliability. Areas of interest include: Test methods and specifications that improve the ability to determine long-term bond durability; New dynamic test methods; New Variants of classic test methods; Nondestructive test methods and more.
To participate, presenters/authors must submit the online abstract form and attach a 250 to 300 word preliminary abstract due by Dec. 3, 2003. The abstract must include a clear definition of the objective and approach of the work discussed.
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