According to Jerry Perkins, director of general industrial marketing at Loctite, “By developing and testing products at a single site, we are able to rapidly standardize adhesives and bring them to market more quickly than ever before. At R2S2, total production time for new adhesives, from initial formulation to delivery, does not exceed 45 days.”
Unique to electronic adhesive manufacturing and packaging is a 1,000-sq-ft clean room where all Loctite underfills, dam and fills, and glob-top encapsulants are manufactured and packaged, ensuring the purity of adhesives with filler particles smaller than 13 microns.
“Our Class 10,000 clean room is completely dedicated to microelectronics adhesive manufacturing and packaging, and, to the best of our knowledge, is the only one of its kind in the adhesives industry,” says Jim Heaton, Loctite director of electronic marketing. “Manufacturing and packaging under Class 10,000 conditions guarantees the consistency, dispersion and size of the fillers that are critical to the performance of our microelectronics adhesives.”
Located 1.5 miles from the Loctite North American headquarters in Rocky Hill, Conn., the facility is the first of three planned R2S2 sites. Two additional facilities will be located adjacent to existing Loctite research and development facilities in Dublin, Ireland, and Yokohama, Japan. These two facilities are scheduled to open by mid-1999. The three R2S2 centers will have identical equipment and will be linked via computer, making possible the precise simulation of global manufacturing processes. The networked computer system will allow engineers around the world to watch processes as they happen, and to immediately download and utilize process information at facilities throughout the world.
Loctite Corporation is a worldwide, market-driven specialty chemical company. Principal markets include electronics, industrial, specialized, medical and automotive. A subsidiary of Henkel KGaA, Loctite Corporation’s world headquarters are in Hartford, Conn.