Cotronics: Adhesive For Dissimilar Materials
April 17, 2000
Resbond™ S5H13 adhesive is specially formulated to bond dissimilar materials for use in high-temperature, corrosive environments. It has excellent adhesion to metals, plastics, high-performance composites, glass and ceramics. The epoxy cures at room temperature and is usable to 500°F. It features excellent high-temperature resistance to corrosion, all common chemicals, thermal shock and electricity.