DEVCON: Adhesive Solders
October 25, 2004
Syon electrically conductive adhesive solders from Devcon can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. These epoxy and epoxide formulations mix and pour easily, fill voids completely, and cure with minimal air entrapment. Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. And Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive.
For more information, visit http://www.devcon.com/devconcatsolution.cfm?catid=33 .