Dow Automotive Systems recently announced plans to move its aftermarket distribution center from Dayton, OH, to Hillsdale, MI, beginning in the fourth quarter of 2011. Hillsdale is the site for the Dow business unit’s small packaging operation.
“Dow Automotive Systems has been supplying its market-leading glass bonding systems to the aftermarket for over 40 years,” said Philip Jentoft, director of Global Aftermarket Sales and Service. “To better manage costs and create operational efficiencies, we will consolidate packaging and distribution to one facility. This move will also help us ensure that the highest quality and freshest product is available to the market.”
For more information, visit www.dowautomotive.com