Dow Corning Corp. has announced the introduction of DOW CORNING EA-6700 Microelectronic Adhesive, a new lid-seal material based on a unique chemistry that makes it ideally suited for the latest generation of flip-chip semiconductor packages. EA-6700 is the newest adhesive to emerge from Dow Corning's expanding family of packaging materials. Adhesives for lid assembly, also referred to as cap assembly, are integral to the production of flip-chip devices, one of the fastest-growing segments of the IC packaging market. In order to ensure device reliability, lid-seal adhesives face the challenge of withstanding high humidity, temperature cycling and extreme operating conditions. EA-6700's unique chemistry improves the long-term reliability of flip-chip devices by offering excellent adhesion, thermal stability and moisture-resistance properties.
For more information, visit http://www.dowcorning.com/electronics.