Adhesives Magazine

EPOXIES ETC.: Potting Compound

November 30, 2011

The new 50-2185 FR urethane potting compound reportedly provides a low glass-transition temperature, low durometer, high thermal conductivity and flame retardancy. In addition, the material can offer excellent heat transfer, low exotherm and beneficial electrical insulating properties.

The urethane system can be used for the potting of electronic assemblies where low durometer, thermal conductivity and self-extinguishing are required.

For more information, visit www.epoxies.com.