FOCUS ON: Henkel Honored with Five Awards at APEX
May 1, 2009
Doug
Dixon, Global Marketing director, and Dr. Michael Todd, vice president of
Product Development & Engineering, display Henkel’s recent awards for Hysol
UF3800 CSP/BGA underfill and Multicore LF700 lead-free, halide-free solder
paste.
Henkel Corp., Irvine, CA, was honored with five awards at the IPC APEX EXPO held March 31 – April 2 at the Mandalay Bay Resort and Convention Center in Las Vegas.
Two Henkel electronics assembly materials - Hysol® UF3800TM CSP/BGA underfill and Multicore® LF700TM lead-free, halide-free solder paste - emerged as winners in their respective categories in several awards contests. Honored by the IPC’s Innovative Technology Center, Circuits Assembly magazine’s NPI Awards and Surface Mount Technology (SMT) magazine’s Vision Awards programs, Hysol UF3800 demonstrated that underfill materials can deliver on several complex and historically unachievable performance criteria. Designed for use with CSP and BGA devices within handheld communication and entertainment products, Hysol UF3800 flows fast at room temperature, is halogen-free and reworkable, and delivers excellent thermal cycling performance. The unique chemistry of the material offers a relatively high glass transition temperature (Tg) required for improved thermal cycle performance, as well as good reworkability - two properties that normally work counter to each other.
Also singled out by the IPC’s contest and Circuits Assembly’s NPI awards program was Multicore LF700, Henkel's new lead-free, halide-free solder paste. Formulated to deliver improved benefits and performance characteristics when compared to older-generation and competitive products, Henkel’s new solder paste goes beyond basic lead-free functionality to deliver advanced enabling capabilities. The material reduces voiding in BGA solder joints, delivers a high tack force to provide stability during high-speed component placement and offers long printer abandon times of up to four hours, even when printed onto extremely fine-pitch 0.4 mm CSP apertures.
“Clearly, customers are the ultimate judge of our R&D success," said Dr. Michael Todd, vice president of Product Development and Engineering at Henkel. "But, having three such prestigious awards programs recognize these groundbreaking materials and our commitment to innovation is very rewarding. We sincerely thank IPC, Circuits Assembly and SMT for sponsoring these important industry contests, and we want to congratulate the dedicated Henkel staff that engineered such truly enabling technologies.”