Adhesives Magazine

Heat-Resistant Epoxy

June 30, 2002
DEVCON

This company's HP 250 high-performance epoxy adhesive is resistant to heat, chemicals and impact. With a viscosity of 105,000 cps, the product is a thixotropic paste that offers excellent gap filling and will not sag or run when used on vertical or inverted surfaces. It cures at room temperature and produces high-strength, durable, non-shrinking bonds to a variety of substrates. Circle No. 133