Adhesives Magazine

HENKEL AND STS:IEMT TO PRESENT SEMICONDUCTOR SEMINAR AT SEMICON WEST

April 26, 2004
During Semicon West in San Jose, Henkel Corp. and STS:IEMT will present "Future Trends in Semiconductor Packaging," a four-hour seminar that will bring together industry leaders to discuss current semiconductor packaging challenges and future industry requirements. The seminar will take place on Tuesday, July 13, from 1:30 to 5:30 p.m. at the San Jose Marriott. Speakers will include recognized experts from Intel, Amkor, Henkel Corp., Sun Microsystems, Asymtek, and TechSearch International. Topics addressed will include low k devices/Cu interconnect, lead-free material sets, the need for "green" packages, 3D architectures for packaging, thermal management, and high-speed dispensing. The seminar is geared toward engineers, scientists and managers involved in the design, process and manufacturing of IC electronic components and packages. The program will also benefit semiconductor manufacturers, packaging service providers, end users and system integrators.

For more information, visit http://www.semi.org/semiconwest/stsiemt or call (408) 943-6901.