Henkel recently announced it has worked with STMicroelectronics to validate the performance of Henkel’s Ablestik C100 conductive die-attach film materials for the production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions. Ablestik C100 materials are available in 15- and 30-micron thicknesses.
Benefits of the films include the elimination of die tilt, the ability to process thinner die and the facilitation of greater bondline control. Providing a high level of manufacturing latitude, the workability of the new materials has been established on die sizes ranging from 0.2 x 0.2 mm up to 6 x 6 mm for multiple package types, including both QFNs and QFPs. These benefits, along with Ablestik C100’s thermal and electrical performance and ability to enable scalable package design, reportedly offer a distinct competitive advantage for leadframe packaging specialists.
For additional details, visit www.henkel.com/electronics