Following a period of extensive lead-free evaluation trials, the electronics group of Henkel has revealed that selected Loctite® Chipbonders® are not only capable of running lead-free, but are designed to optimize lead-free processes, eliminating chip loss and saving components by low-temperature curing systems. The trials involved testing a range of Loctite Chipbonder adhesives on "difficult-to-bond" components. Using Loctite Chipbonder test boards, the trials employed both lead-free and tin-lead dual wave solder machines using a range of Multicore® fluxes. The results proved that Chipbonders 3609, 3616, 3621, 3627 and 3629 are optimized for lead-free compatibility.
For more information, visit www.electronics.henkel.com.