Adhesives Magazine

Henkel Loctite Corp: Epoxy Molding Compound

September 17, 2003
Henkel Loctite Corp. has introduced Hysol GR725, a semiconductor-grade molding compound designed for use on Power ICs and Power Discrete devices that operate at high temperatures and require good electrical stability. It is a green, non-Bromine/Antimony, epoxy cresol novolac-type material with excellent molding characteristics. The product is flame retardant and offers good adhesion to Ni/Pd/Au and Cu/Ag lead frames. This high-productivity molding compound offers a wide processing window and provides 20,000 hours at 200 degrees C HTSL. It meets JEDEC Level 1 260¿C reflow requirements and UL 94 V-O at 1/8-inch thickness.

For more information, call 716-372-6300.

http://www.loctite.com/electronics