Henkel Loctite Corp: Underfill Material
October 1, 2003
Henkel Loctite Corp. introduced an advanced underfill material that offers enhanced properties for leading edge semiconductors that use low k inner layer dielectric materials for wafer fabrication. Formulated specifically for flip chip packaging, Hysol FP4580 prevents cracking and delamination of the chip's fragile inner layers. The company worked closely with LSI Logic Corp. to develop and test Hysol FP4580, a high purity, low stress liquid epoxy. The product offers performance on copper/low k flip chip laminate packages up to 50 x 50 mm with more than 4,000 bumps. The underfill's physical properties are optimized to balance low stress at the inner layer of the chip with low strain on solder bumps.
For more information, call 716-372-6300.