Laird Technologies Inc. has
announced the addition of three new products to its EMI Sentry
TM Form-In-Place
gasket family.
Laird Technologies Inc., a
global leader in the design and manufacture of customized, performance-critical
components for wireless systems and other advanced electronics applications, has
announced the addition of three new products to its EMI Sentry
TM Form-In-Place
gasket family.
This Form-In-Place
gasket family provides EMI shielding while offering heat and humidity
resistance, excellent adhesion strength, and a minimal compression set. These
qualities improve reliability by increasing the durability and longevity of assemblies. In
addition, fast handling and rapid curing speed up productivity, while increased
softness offers the cost saving advantage of volume dispensing.
The three new gasket products
are composed of specially designed pastes that can be dispensed onto a metal or
plastic substrate:
- SNC70-HXP - consists of
nickel/graphite-filled silicone that cures at HTV (High Temperature
Vulcanization)
- SNC70-RXP - consists of
nickel/graphite-filled silicone that cures at RTV (Room Temperature
Vulcanization)
- SNN60-RXP - consists of
silver/nickel-filled silicone that cures at RTV (Room Temperature
Vulcanization)
The EMI Sentry gasket family
is ideal for the handset, base station, military and consumer electronics markets.
For more information, visit
www.lairdtech.com.
