Adhesives Magazine

Participate in TAPPI’s Hot Melt Symposium

November 28, 2000
The Hot Melt Committee of TAPPI's Polymers, Laminations & Coatings Division has issued an invitation to industry professionals to participate in the 2001 TAPPI Hot Melt Symposium to be held June 10-13, 2001, at the Westin Hotel, Hilton Head, S.C. The symposium will address such topics as the Stage Gate, a process for new-product commercialization; the use of hot melts as sealants; the market potential of hot melts in the United States, Europe and the Far East; combinatorial hot melt chemistries and their synergistic effect in performance and cost; and the issue of solvent use in the United States.

The theme for the 2001 tutorial is "Back to Basics." The tutorial will address such topics as a review of test methods for PSAs; packaging and structural applications; formulation and function of raw materials for hot melt adhesives; and process equipment.

Authors interested in presenting a paper on these or related topics for the main conference should call Georges Altounian, Hercules; call 302-995-4033; e-mail galtounian@herc.com. Authors interested in presenting a paper at the tutorial should contact John Tangen, 3M; call 651-736-6578; email jctangen@mmm.com. Titles and abstracts are due by December 15, 2000. Final manuscripts are due by March 15, 2001.

For more information about TAPPI's 2001 Hot Melt Symposium, call TAPPI's Service Line at 800-332-8686 (U.S.), 800-446-9431 (Canada) or 770-446-1400. Alternatively, visit TAPPI's Web site at www.tappi.org.