Adhesives Magazine

PMMI ISSUES CALL FOR PRESENTATIONS AT PACK EXPO

March 1, 2004
The Packaging Machinery Manufacturers Institute (PMMI) has issued a call for presentations for the Conference at PACK EXPO to be held in conjunction with PACK EXPO International scheduled for Nov. 7-11, 2004, at McCormick Place, Chicago. Packaging professionals with engineering, production, and operations titles interested in offering technology-focused, non-commercial presentations relating to conference topics are invited to submit abstracts of their proposed presentations to Samara Wolf, program coordinator, PMMI, at swolf@pmmi.org no later than April 9, 2004. Conference management and an advisory panel composed of packaging professionals will evaluate the proposals in terms of the technical, scientific and production data presented or trends covered and their interest to an audience of packaging professionals. The advisory committee is acting on behalf of conference attendees who are not interested in "sales pitches," but are looking for informed and insightful technical analyses and market experiences. Please note that proposals for "first-party presentations" - presentations about technologies, products or services available from the presenter's company - will not be accepted. Proposals for presentations on specific commercial developments made by users of those developments will be considered on a case-by-case basis. Topics of particular interest for the Conference at PACK EXPO include radio frequency identification (RFID), security, anti-counterfeiting packaging strategies, packaging automation, and more.

For more information, contact Samara Wolf at swolf@pmmi.org .