Adhesives Magazine

Potting Compounds and Encapsulants

July 31, 2001
DEVCON


DEVCON
This company offers a range of epoxy and urethane potting compounds and encapsulants with superior flexibility, and impact and environmental resistance. Available in low-shrink and non-shrink formulations, these compounds cure quickly at room temperature with minimal air entrapment. They are ideal for protecting electronics, wiring and other components subject to damage from moisture, temperature extremes or cycling, or shock and vibration.

Circle No. 112